Industrial

Global Semiconductor Packaging Equipments Market Report to Share Key Aspects of the Industry with the details of Influence Factors

Semiconductor packaging is carried out to provide extra protection to wafers or substrates. The package casing is made up of materials such as metal, plastic, glass, or ceramic and contains one or more semiconductor electronic components. Accounting for more than 55% of the total market shares, the die-level packaging equipment segment dominated the market. This growth can be attributed to the increasing demand for application processors, basebands, and SoCs, which are integrated into mobile and consumer electronic devices. Though the market shares of this segment will decline due to the use of advanced technologies, this segment will continue to dominate the market throughout the forecast period.

According to this market study, the OSATs will account for more than 58% of the total market shares and will also dominate the semiconductor packaging equipment market throughout the predicted period. The migration of a number of semiconductor manufacturers to the fabless model is identified to be the major factor for the growth of the market segment. Additionally, the development of new technologies such as FOWLP, 2.5D, and TSV has also increased the outsourcing of back-end processes, which will also fuel the growth of this market segment.

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The global Semiconductor Packaging Equipments market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.

This report focuses on Semiconductor Packaging Equipments volume and value at global level, regional level and company level. From a global perspective, this report represents overall Semiconductor Packaging Equipments market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.

Key companies profiled in Semiconductor Packaging Equipments Market report are Applied Materials, ASM Pacific Technology, Kulicke and Soffa Industries, Tokyo Electron Limited, Tokyo Seimitsu and more in term of company basic information, Product Introduction, Application, Specification, Production, Revenue, Price and Gross Margin (2014-2019), etc.

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Table of Content

1 Semiconductor Packaging Equipments Market Overview

2 Global Semiconductor Packaging Equipments Market Competition by Manufacturers

3 Global Semiconductor Packaging Equipments Production Market Share by Regions

4 Global Semiconductor Packaging Equipments Consumption by Regions

5 Global Semiconductor Packaging Equipments Production, Revenue, Price Trend by Type

6 Global Semiconductor Packaging Equipments Market Analysis by Applications

7 Company Profiles and Key Figures in Semiconductor Packaging Equipments Business

8 Semiconductor Packaging Equipments Manufacturing Cost Analysis

9 Marketing Channel, Distributors and Customers

10 Market Dynamics

11 Global Semiconductor Packaging Equipments Market Forecast

12 Research Findings and Conclusion

13 Methodology and Data Source